Super Low-Void & Anti-pillow
No-clean lead free solder paste
Ensures outstanding continual printablility with super fine
pitch (0.4mm/16mil) and CSP (>0.25mm dia.) applications for normal to
fast printing (10 ~ 80mm/sec.) and long stencil idle time.
Highly heat resisting and perfect melting and wetting at
super fine pitch (<0.4mm pitch) and micro components (<0.3mm dia
CSP, 0603 chip).
Conforms to Halogen-free standard (Cl + Br： below1500ppm) EN-14582
S3x58-M500 is specially formulated flux chemistry ensures extremely low
voiding with CSPs and broad contact area components, e.g. QFN.
It´s designed to prevent occurrence of hidden pillow defects.
And enables reuse of leftover from previous day =Economical.