Multi-feature Lead-free Solder Paste For Fine Pattern Application
Flux Gas Discharge Effect
The technology designed to reduce voids by rapidly discharging flux through the Active Coagulation Effect in the first step.
For the second step, the Extended Active Outflow Effect continues to discharge any remaining voids, realizing the lowest void performance ever achieved.
Activation Boost Effect
This begins with Activation Stabilizer technology, which prevents premature chemical reactions during storage and transportation by stabilizing the activator system's
reactivity.
Upon exposure to reflow heating, the stabilizer is released, unlocking maximum activation power.
For the second step, the newly formulated high-temperature-resistant activator, with superior activation in hightemperature
zones, ensures robust and powerful solder meltability and wetting, despite being halogen-free.
This breakthrough significantly enhances the flexibility of reflow profile design, providing a broad process
window for a wide range of applications.
◼ Solder alloy composition： Sn3.0Ag0.5Cu
◼ Exhibits excellent print quality response with >1hour stencil idle time
◼ Powerful wetting as good as Halogen containing solder paste
◼ Succeeded to drastically mitigate flux splattering
◼ Ensures good meltability at smaller components in Air / N2 reflow (e.g. 0402 metric size chip component)
◼ Realizes low voiding with BTCs (e.g., Pw.Tr., QFN, LGA) and BGA
◼ Comply with Halogen Free standard (Cl+Br = 0ppm): BS EN14582
No artificial addition of any halogen element
◼ Flux type: ROL0 (Cl+Br+I+F = <0.05% / IPC J-STD-004B and 004C, D)
◼ RoHS, REACH compliant product